TO-254 and TO-257 Ceramic Packages for Power Electronics

Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies

Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages. The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products.