Applications of XPE foam in Microelectronics industry A. Semiconductor industry 1. Integrated circuits :Digital IC , monolithic IC , thick-film IC , the MOS containing IC , hybrid IC and so on ; characterized by the pattern and packaging; 2. Semiconductor tube : diodes, ...
Black XPE Conductive Foam Packing Insert For Electronic products Description: * XPE is an ideal material for heat preservation of automobiles and air conditioners. * It has developed rapidly in the sporting goods market in recent years, such as surfboard, moisture-proof mat, ...
Black New environmental conductive Packing Foam Insert Factory Direct Custom molded ESD PU Foam Packaging Product details Material PU sponge Thickness 1-100mm Color Black Surface Resistance 103-109 Ω Certificate SGS, ISO9001, ROHS MOQ No MOQ Size Custom Size Product Keywords PU ...
OEM Black ESD polyurethane packing foam Factory Direct Custom molded ESD PU Foam Packaging Product details Material PU sponge Thickness 1-100mm Color Black Surface Resistance 103-109 Ω Certificate SGS, ISO9001, ROHS MOQ No MOQ Size Custom Size Product Keywords PU Sponge insert ...
Based on Your Drawings Cutting Foam Inserts Polyurethane Foam Sponge Insert Factory Direct Custom molded ESD PU Foam Packaging Product details Material PU sponge Thickness 1-100mm Color Black Surface Resistance 103-109 Ω Certificate SGS, ISO9001, ROHS MOQ No MOQ Size Custom ...
Black Conductive Polyurethane (PU) / Polyethylene (PE) Foams ...
* case shells made of Ultra High-Impact ABS Plastic * air pressure compensation valve * 2 locks * 1 handle * carrying strap possible * temperatures ranging from -40 degrees up to +80 degrees C * very sturdy stackable * ...