Black XPE Conductive Foam Packing Insert For Electronic products

Place Of Origin
China (Mainland)
Certificate
SGS, ISO9001, ROHS
Thickness
1-100mm
Process Type
Pulp Moulding
Minimum Order
1
Material
XPE foam
Size
Customized Accept
Color
black
Usage
Electronic
Packaging
Customized Packing with Carton
Delivery
7-15 Days

Applications of XPE foam in Microelectronics industry


A. Semiconductor industry
1. Integrated circuits :Digital IC , monolithic IC , thick-film IC , the MOS containing IC , hybrid IC and so on ; characterized by the pattern and packaging;
2. Semiconductor tube : diodes, transistors / crystal , thyratron , etc .
3. Being used as pulg-in sheet inserted by IC pin ,conductive foam makes the electric potential difference between the PINs is zero , not only anti-static ,but also fixing and protecting the IC pin.


B. Applications in PCB and various boards
1. Containing the aforementioned components of the PCB , board;
2. Module containing the aforementioned components , devices, such as the light source modules, photovoltaic modules , communication modules , IGBT modules,etc;
3. Compounded with anti-static ,buffering and circulating properties,conductive IXPE foam trays for Hard Disks,Cell phones, Motherboards and Memory Bar have irreplaceable advantages to the traditional injection molding trays,which make sure the maximum protection to those devices when circulating .

C. The use of the aforementioned components, boards, modules packages, electronics, telecommunications industry
1. Mobile phones, computers/notebook computers in particular, high-definition television and other consumer devices;
2. Cable television network,IP,IT and other communications,video,wired and wireless networks.
3. Compared with traditional hollow board,conductive IXPE foam board is not only flexible and buffering but also non-traumatic to electric devices and hands,while traditional hollow board is very easy to scratch electronic and hand in the process of use. The most important thing is that IXPE foam's life is as several times longer as hollow boards'.

Contact me: Rebecca Wang

Mobile: 008618086191689

Skype: df45881967f15ce6

Wechat: wmy18086191689

  • Country: China (Mainland)
  • Business Type:
  • Market:Europe
  • Founded Year:2010
  • Address:
  • Contact:rebecca wang
more images of Black XPE Conductive Foam Packing Insert For Electronic products
more images of Black XPE Conductive Foam Packing Insert For Electronic products
*Your name:
*Your Email:
*To:JingZhou Sinkery Electronic Technology Co., Ltd
*Subject:
*Message:
Enter between 20 to 3,000 characters. English only.     Characters : 0 / 3000
*Enter the secure code shown below Mfrbee security Image      Reload Image

submiting now We do inquire for you , please wait ...

Customized Black ESD Conductive XPE Foam Packing Tray
Customized Black ESD Conductive XPE Foam Packing Tray

Black ESD Corrugated Box 1. Material: PP material. 2. Usage: Used for heavy components’ packing, circulation and storage. 3. Resistance: <106Ω. 4. Can use corrugated sheet. 5. Can use corrugated sheet cover, vacuum cover. Resist against dust. 6. Can have print. 7. Stackable ...

JingZhou Sinkery Electronic Technology Co., Ltd

Black XPE Conductive Foam Packing Insert For Electronic products
Black XPE Conductive Foam Packing Insert For Electronic products

Black XPE Conductive Foam Packing Insert For Electronic products Description: * XPE is an ideal material for heat preservation of automobiles and air conditioners. * It has developed rapidly in the sporting goods market in recent years, such as surfboard, moisture-proof mat, ...

JingZhou Sinkery Electronic Technology Co., Ltd

120 High temperature resistance conductive xpe foam for packing insert
120 High temperature resistance conductive xpe foam for packing insert

120 High temperature resistance conductive xpe foam for packing insert Why choose us? 1.We are specialized in producing ESD Foam packaging since 2009, so we are more professional. 2. We can provide a reasonal price for our products because we are a factory-direct. 3. No MOQ for ...

Suzhou Sinkery Electronic Technology Co.,Ltd.

Injection Box with XPE Foam Insert for Electronic Product Packaging
Injection Box with XPE Foam Insert for Electronic Product Packaging

Injection Box with XPE Foam Insert for Electronic Product Packaging Material Specification of Conductive PE Foam 1.Basic Process The said product is a close-cell, conductive foam. It is produced by compounding the PE resin with conductive fillers & blowing agents to extrude ...

Suzhou Sinkery Electronic Technology Co.,Ltd.

EVA Conductive Foam Inserts use for Electronic products packaging
EVA Conductive Foam Inserts use for Electronic products packaging

EVA Conductive Foam Inserts use for Electronic products packaging High Density EVA Foam. The hardness of the EVA foam can be 40°, 50°, 60°, 70°。 Higher and the EVA will be stronger. Features: 1. It promotes the rapid release of electrostatic without using the ...

Suzhou Sinkery Electronic Technology Co.,Ltd.

Black New environmental conductive Packing Foam Insert
Black New environmental conductive Packing Foam Insert

Black New environmental conductive Packing Foam Insert Factory Direct Custom molded ESD PU Foam Packaging Product details Material PU sponge Thickness 1-100mm Color Black Surface Resistance 103-109 Ω Certificate SGS, ISO9001, ROHS MOQ No MOQ Size Custom Size Product Keywords PU ...

Suzhou Sinkery Electronic Technology Co.,Ltd.

Conductive polyethylene foam IXPE package XPE sheet for electronic products
Conductive polyethylene foam IXPE package XPE sheet for electronic products

Conductive polyethylene foam IXPE package XPE sheet for electronic products Features: IXPE FoamSpecification: Thickness: 1-100 mm. Hardness: 20,30 Color: Black Size: Customized Material Specification of Conductive PE Foam 1.Basic Process The said product is a close-cell, ...

Suzhou Sinkery Electronic Technology Co.,Ltd.