item | technical parameters | specifications |
min. line width | 1-40layers | |
min. line space | 2mil/2mil | Partial 2mil lines is allowed |
min.annular ring width | 2mil/2mil | Partial 2mil lines is allowed |
min. hole size | vias :3mils ;component holes:7mils |
Remained ring width means the distance between the hole edge to the ring outskirt |
min. board thickness | 0.4mm | |
max. board thickness | 8.0mm | |
max. board size | 700*1200mm | |
min. board thickness | Single and Double Sided:0.2mm; 4 layers:0.4mm; 6 layers:0.6mm; 8 layers:1.0mm;10 layers:1.2mm | |
distance between line and board edge | 0.2mm | |
solder mask | White,Black, Blue,Green,Yellow,Red ect | |
ledgend color | White,Black,Yellow ect | |
surface finish |
HAL(with Pb free),Plated Ni/Au,Immersion Silver ,Imm Ni/Au, Imm Sn, Hard gold, OSP etc. |
|
plating thickness | hard gold :Au(5uin-120uin);imm gold:Au(2uin-4uin);gold finger:Au(5uin-120uin) | |
copper plating hole | 20um-25um | |
base copper thickness | 1/3oz-6oz | |
finish copper thickness | 1-10oz(outerlayers);0.5oz -6oz (innerlayers) | |
min. insulation layer thickness | 2mil | |
line width /space | max. copper thickness |
Line width shouldn't be less than the required value under ensure of space |
3mil/3mil;4mil/4mil;4mil/5mil | 0.5oz | |
4mil/6mil/5mil/5mil;6mil/5mil | 1oz | |
5mil/6mil;6mil/6mil | 2oz | |
6mil/8mil;7mil/8mil;8mil/8mil | 3oz | |
8mil/10mil;9mil/10mil;10mil/10mil | 5oz | |
board materials | FR4/FR1/ FR2/ FR3/ CEM1/ CEM3/ ROGERS/ ARLON/ ISOLA | |
hole size tolerance | +/-0.03mm | |
hole position tolerance | +/-0.03mm | |
board outline tolerance |
L<=100mm: 0.1mm; 200mm 100mm300mm: 0.4mm |
|
finished product thickness tolerance |
0.2mm T>=0.8mm: +/-8% |
|
impedance controal | ± 10% | |
bow and twist | ≤0.5% |
|
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