silicone sealant LED drive Drive power Thermally conductive potting

ZS-GF-5299

1.Features

ZS-GF-5299 is a low viscosity two-component addition cure silicone sealant, that can be cured at room temperature or heat cure, the higher the temperature, the faster the curing. This product does not produce any byproducts in the curing reaction, which can be applied for PC (poly-carbonate)、PP、ABS、PVC and other surface of metal. Complied with the ROHS、REACH of EU directive.

2.The Typical Application

Encapsulating and protecting the power module, or other electronic components.

3.TECH.DATA

The above data are measured after curingof7 daysat 25 ° C, relative humidity is 55%. The company assumes no responsibility for different testing conditions or product improvements resulting from different data .