ABM63C 6.0 x 3.5 x 1.2mm ABM63C 6.0 x 3.5 x 1.2mmCeramic Glass sealed ? 4-pads ? 8MHz to 48MHz
DIODE TRIO FOR EUROPEAN, 11SI REPLACES DELCO REMY#3472312,7982635,DR3901,D3901DELCO REMY(EUROPEAN)#1984032
VCSEL 1550nm single chip with n Chan. VCSEL chip Array & submount
Rectifier Diode Stud Diode Stud - overview W0438x Stud Diode 1600~2400V Itave 320A @100
Features * Mesa diode on semi-insulating substrates * Anode/Cathode bonding pads on front side GD6007-100 1310/1550nm InGaAs PIN Photodiode for 1-3 Gb/sec Features * Mesa diode on semi-insulating substrates * Anode/Cathode bonding pads on front side * Low dark current & capacitan
Delivery Time 7-10 days after receiving desopit receipt Package Inner package Anti-static Rigid tubeOuter Package Carton protection Supply Ability 100,000 Piece/Pieces per Week Minimum Order Quantity 1 Piece/Pieces Payment Terms T/T,Western Union Max. Forward Current 1050mA Max.
Plastic package has Underwriters Laboratory Flammability Classification 94 V-O FEATURES Plastic package has Underwriters Laboratory Flammability Classification 94 V-O Glass passivated junction 5000W Peak Pulse Power capability on 10/1000
BAS70W / AW / CW / SW 1000 1000 0.55 0.45 - 0.85 40 20 100 SOD-123 SOD-123FL SMD SMD SS1040 SS1020FL SS10100FL NEW 450 500 500 20 / 200 1.0 0.385 - 0.51 0.385 - 0.51 0.37 / 0.60 0.39 - 0.41 20 40 20 40 20 40 40 60 SOD-123FL SOD-123 SOD-123 SOD-123 SMD SMD SMD SMD SS0520FL SS0540F
CPDF5V0 15 8 1005 (2512) 4000-T&R 7" CPDF12V 25 8 1005 (2512) 4000-T&R 7" Number VC(V) VESD(kV) Package Packing All All All 0402 (1005) 0503 (1308) 0603 (1608) 1005 (2512) SOD-123F SOD-523 SOT-383 All 3000-T&R 7" 4000-T&R 7" 5000-T&R 7" CPDF5V0 15 8 1005 (2512) 4000-T&R 7" CPDF12
Low Reverse Current Product Description The Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. T
Product Crystal Series MF Package Type SMD (6.0 x 3.5 x 1.0 mm) RoHS compliant and lead-free product The whole package is grounded via the topmetal lid and the two bottom pads . Tight tolerance and tight stability. Ideal for telecommunications Withstand solder reflow. EIA-481A ta
SFR Active Power Component SFR Active Power Component
Silicon Tuning Diode This device is designed in the Surface Mount package for general Silicon Tuning Diode This device is designed in the Surface Mount package for general frequency control and tuning applications. It provides solidstate reliability in replacement of mechanical t
Industrial standard package Pressure contact Industrial standard package Electrically isolated base plate Simplified mechanical design, rapid assembly
Applications-Decorative Lighting-Spot LightsLarge message boards-E27 Base-Low Power Consumption Click on part number Applications-Decorative Lighting-Spot LightsLarge message boards-E27 Base-Low Power Consumption Click on part number to view pdf datasheetProduct Gallery>Filament
