SMDK2412 is a reference board that is suitable for developing mobile systems based on SAMSUNG S3C2412 mobile chip as well as tes SMDK2412 is a reference board that is suitable for developing mobile systems based on SAMSUNG S3C2412 mobile chip as well as testing the chip itself. S
Model Number IRFP250N Place of Origin United States Model Number IRFP250N Place of Origin United States IRFP250N For more information, please Min order 10,000pcs Price USD1.50/pc FOB USA Organ USA IRFP250N IC Chip
FK148 4 Way LED Traffic Light$14.27 FK148 4 Way LED Traffic Light Suitable for model builders such as model railway and model village hobbyists PCB Dimensions 30.5x90mm Power 9-12VDC Price $14.27 inc GST plus P&P
(1) PICMG ver. 1.3 RC1.0 SHB slot for SHB Express(1) PCI-E 16X slot(2) PCI-E 1X slot(1) PCI 32 bit 5V slots(2) SATA connect (1) PICMG ver. 1.3 RC1.0 SHB slot for SHB Express(1) PCI-E 16X slot(2) PCI-E 1X slot(1) PCI 32 bit 5V slots(2) SATA connectorsSupports ATX 24P power connect
products are low-cost, high quality FlatPanel Display in both PC and TV market. The major applications of MSTC's products are low-cost, high quality FlatPanel Display in both PC and TV market. With tremendous amount of dedicated efforts, a fast time-to-market capability, MSTC can
VJ Engineering Trading & Services provide engineering services and supplies obsolete parts. Email
Package antistatic tube Supply Ability 1000 Piece/Pieces per Day Minimum Order Quantity 1 Piece/Pieces Payment Terms T/T Port Liverpool Fob Price GB Supply Voltage 2.4 - 4.8 Application Electric Toy Type Logic ICs Model Number 1 Brand Name KicChip Place of Origin United Kingdom R
Independent distributor of military and commercial electronic circuits such as diodes, transistors, capacitors and resistors.
Protocol PS/2 Model Resolution 2048 x 2048 5.iMac 9.0/ OS X 4.MS-DOS 3.Linux (up to Kernel 2.6) 2.Windows CE 2.12/ 3.0/ .net/ 5.0 1.Windows 95/ 98/ ME/ NT4/ 2000/ XP/Vista OS Support 2. Configurable double click area 1. Configurable double click speed Double Click 1. No sound 2.
Integrated Circuit IC Heat Sink Pad Heat Dissipating Agent Integrated Circuit IC Heat Sink Pad Heat Dissipating Agent
The TC4542 is a four-stage PHEMT power amplifier MMIC that is designed for use as an output stage in VSAT ODU. FEATURES P-1 dB 33 dBm Small Signal Gain 26 dB IP3 41 dBm Bias Condition 1500 mA @ 8 V DESCRIPTION The TC4542 is a four-stage PHEMT power amplifier MMIC that is designed
6.0V ~ 12V Audio volume controller IC . Built in 2 channels in IC body, attenuation can be control by digital signal attached to the strobe ( ST ) , data , clock pins . 0 dB ~ 66 dB changing with 2 2 dB attenuation each step . Both of dual power supply of ( + ) and ( - ) or singl
It is easy to use, and an ideal introduction for users who have never designed with FPGAs before The Cyclone III FPGA Starter Development Kit is RoHS compliant and features Prodcut information on Altera Website Cyclone III FPGAs are the first low-cost FPGA family available in the
Application VCD/DVD Player Type Drive IC Place of Origin Haryana India Application VCD/DVD Player Type Drive IC Place of Origin Haryana India Integrated Curcuits We hereby introduce ourself as a leading importer of ELECTRONICS GOODS in India. Pls feel free to contact us.
The EM6323 and EM6324 are low power, high precision reset ICs featuring a manual reset and a watchdog inputs
Integrated Circuits & Transistors HD6803P1-HIT-410 PAL16R4B-MMI-600 R2332LP-100 7905-TSL-154 6805 PAL16R4DA-MMI-340 M2365-AMD-100 7906-ST-200 MCM6810-MOT-500 PAL16R8B-MMI-890 MP2601-HP-270 7908-ST-300 6818-HIT-200 PAL20V8-MMI-150 2532-SIG-190 7909-ST-710 6821-ST-290 PAL20V10-MMI-
I AM A TRADER OF ELECTRONIC COMPONENTS (IC'S & TRANSISTORS) IN INDIA (NEW DELHI).
Pre-amplifier, post amplifier, LDD, PD The integrated circuits and optical devices are designed for optical transmitter and receiver applications up to 100 Gb/s. They are available in both die or packaged forms. eGtran supplies a broad range of opto-electronics components includi
Thick Film Printed Substrate Thick Film Hybrid Circuit Thick Film Printed Substrate Thick Film Hybrid IC Diode Rectifier Bridge