Wafer Back Grinding Wheel

Place Of Origin
Zhengzhou City, Henan Province, China
Minimum Order
1
Packaging
Paper Box
Delivery
15-20 days

E-Grind Back Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. Our Back-Grinding wheels use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. Our back-grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.

Performance of Wafer Back Grinding Wheel
Leading technology

Good self-sharpening

No dressing required

High yeild rate of work-piece

Applications of Wafer Back Grinding Wheel
Used for wafer's back thinning in LED and Semiconductor industries.

Specifications of Wafer Grinding Wheel
Product Specification
Available shape 6A2T
Machine GALAXY, SPEEDFAM
Working Condition
Grinding Type Wet

There are many cbn grinding wheel suppliers in China, but we are one of the best choices for you.

If you want to know more kinds of crankshaft grinding wheels, please visit our website.

  • Country: China (Mainland)
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  • Address:Room 1841, Tower A, Wanda Plaza, 171#, Zhongyuan Road, Zhengzhou City, Henan Province, China
  • Contact:egrindwheel com
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