Diamond Dicing Blade for motherboard grooving

FOB Price
USD $40.00 / Piece
Place Of Origin
China
Minimum Order
5
Packaging
Outer packaging: hard carton Filling: plastic foam pad
Delivery
15 Days

Brief Introductions:

Type: 1A1R
Bond: Resin or Metal
Application: Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN(copper epoxy molding ), splitter, sapphire
Specification: Customized
Brand Mark: Moresuperhard
Trade Terms: FOB
Packages: Hard carton
Delivery Time: 15 workdays by express

Introductions of Moresuperhard’s Dicing Blades

Diamond dicing blade is sintered from a combination of diamond powders and bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance, is used for cutting and slotting of electronic and optical components.

D(mm) T(mm) U(mm) H(mm) X(mm)
4” /100 0.5, 0.6, 0.8, 1.0, 1.2, 1.5 0.4, 0.5, 0.6, 0.8, 1.0, 1.3. 20, 31.75 5, 10
5”/ 125 0.5, 0.6, 0.8, 1.0, 1.2, 1.5 0.4, 0.5, 0.6, 0.8, 1.0, 1.3 20, 31.75 5, 10
6”/ 150 0.6, 0.8, 1.0, 1.2, 1.5, 1.8 0.5, 0.6, 0.8, 1.0, 1.3, 1.6 20, 31.75 5, 7, 10
8”/ 200 0.8, 1.0, 1.2, 1.5, 1.8 0.6, 0.7, 0.8, 0.9, 1.1, 1.2, 1.4, 1.5. 20, 31.75 5, 7, 10
12”/ 300 1.0, 1.2, 1.4, 1.5, 1.7, 1.8 0.7, 0.9, 1.1, 1.4 20, 31.75 5, 7, 10
16”/ 400 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 0.9, 1.2, 1.4, 1.6, 2.0 20, 31.75 5, 7, 10
20”/ 500 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 0.9, 1.2, 1.4, 1.6, 2.0 20, 31.75 5, 7, 10
Other size can be made according to customers’ requirement

Detailed Specifications can be customized!

Advantages of Moresuperhard’s Dicing Blades

– Excellent cutting ability that help reduce chipping, fractures and achieve smooth surface finish

– Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc.

– Able to precisely control diamond concentration to achieve cutting quality

– Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3μm to 250μm depending on blade thickness

  • Country: China (Mainland)
  • Business Type: Henan MoreSuperHard Products Co Ltd.,Manufacturer
  • Market:Moresuperhard
  • Founded Year:2014
  • Address:No.0906, 9F, Unit 2, No.11 Complex Building, No.171 Zhongyuan Middle Road, Zhongyuan District
  • Contact:Jason Guo
more images of Diamond Dicing Blade for motherboard grooving
more images of Diamond Dicing Blade for motherboard grooving
*Your name:
*Your Email:
*To:Henan MoreSuperHard Products Co Ltd.
*Subject:
*Message:
Enter between 20 to 3,000 characters. English only.     Characters : 0 / 3000
*Enter the secure code shown below Mfrbee security Image      Reload Image

submiting now We do inquire for you , please wait ...