3 IN 1 eMMC153/169 eMCP162/186 eMCP221 pin pitch is 0.5mm. eMMC/eMCP 3 IN 1 adapter can be read and written fastly. BGA153 BGA169 BGA162 BGA186 BGA221 Data Recovery.
3 IN 1 eMMC153/169 eMCP162/186 eMCP221 Test Socket To SD
3 IN 1 Test Socket To SD Feature:
Apply to eMMC/eMCP of for Samsung, Sandis k, for Toshiba, Hynix, for Micron, HTC, MTK, Intel etc .
Apply to BGA153/169 & BGA162/186 & BGA221 test
eMMC/eMCP data can be read and written fastly
Accurate positioning on flat bottom pad and solder of eMMC/eMCP
Support flat bottom and solder ball testing .
Technical support and datasheet are available if you need .
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us .
Specification and Dimension:
Type: Test & Programming Socket ( with pcb )
Package: eMMC153/169, eMCP162/186, eMCP221
Pin Pitch: 0.5 mm
Applicable IC body size: 11.5X13mm, 12x16 mm, 12x18mm, 14x18mm
eMMC/eMCP thickness: 0.8mm - 1.5mm