3 IN 1 eMMC153/169 eMCP162/186 eMCP221 Test Socket To SD

Place Of Origin
CN
Minimum Order
1
Packaging
Carton
Delivery
2-3 working days

3 IN 1 eMMC153/169 eMCP162/186 eMCP221 pin pitch is 0.5mm. eMMC/eMCP 3 IN 1 adapter can be read and written fastly. BGA153 BGA169 BGA162 BGA186 BGA221 Data Recovery.


3 IN 1 eMMC153/169 eMCP162/186 eMCP221 Test Socket To SD

3 IN 1 Test Socket To SD Feature:

Apply to eMMC/eMCP of for Samsung, Sandis k, for Toshiba, Hynix, for Micron, HTC, MTK, Intel etc .

Apply to BGA153/169 & BGA162/186 & BGA221 test

eMMC/eMCP data can be read and written fastly

Accurate positioning on flat bottom pad and solder of eMMC/eMCP

Support flat bottom and solder ball testing .

Technical support and datasheet are available if you need .

we are the original manufacturer and welcome anyone to be our distribution agents

Professional manufacturer in all kinds of IC chip testing sockets and adapters.

More types of sockets and adapters for eMMC, eMCP, SOP, SSOP, TSSOP, QFP, QFN, BGA, SOT, MSOP, DFN and customize design, for customized socket and more product detail, please feel free to contact us .

Specification and Dimension:

Type: Test & Programming Socket ( with pcb )

Package: eMMC153/169, eMCP162/186, eMCP221

Pin Pitch: 0.5 mm

Applicable IC body size: 11.5X13mm, 12x16 mm, 12x18mm, 14x18mm

eMMC/eMCP thickness: 0.8mm - 1.5mm
  • Country: China (Mainland)
  • Business Type:
  • Market:
  • Founded Year:2014
  • Address:Rom 202, tangshuiwei Area, block 8, mingzhi , Shenzhen
  • Contact:Una Wrong(nandrepair.com)
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